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KULICKE & SOFFA (ASIA) LTD
8020 AWBBond ParametersGuideline
8020 AWB Bonding Parameter Definitions- based on 8-28-2-23 s/w version
Table 1-1 First Bond ParametersParameterDefault / Allowable RangeFunctionTip 1Default = 5 mils
Min = 0 mil
Max = 25 milsConstant velocity inflection offset, for 1st bond height searching
Note: - The bondhead descend from its Reset Height [1] at hi-speed [2] - Wire clamp is open during the period of hi-speed descend - Wire clamp is closed at Tip1, where bondhead switches into constant velocity [3] - Typical range is from 5 mils to 8 mils, yet higher Tip1 helps to minimize ball smash
CV 1
Default = 0.5 mils/ms
Min = 0.2 mils/ms
Max = 3.0 mils/msConstant velocity (searching) speed for 1st bond
Note: - The bondhead descend to search for the 1st bond (die surface typically) height at a Constant Velocity [4] - Upon touching the die surface, the bondhead senses the change of CV1 as defined by Contact Threshold to determine Contact [5] - CV1 and Tip1 are important to control the ball thickness - 0.8mils/ms to 1mils/ms is typical for standard applications, while lower CV1 might be needed for FP applications
ParameterDefault / Allowable RangeFunctionUSG Mode 1Default = C. Current
Min = C. Power
Max = C. VoltageUSG output mode for 1st bond: CP - constant power CC - constant current CV - constant voltage
Note: - Selecting one mode will disable the other two modes - Recommend to use constant current mode for maximum parameter portability
USG Power 1Default = 400 mW
Min = 0 mW
Max = 4000 mWSets USG Power level (CP mode) for 1st bonds
Note: - Under USG CP mode, the product of the voltage across and the current through the transducer is held constant, yet the transducer impedance still affect the performance of USG output consistency in this mode
USG Volts 1Default = 3500 mV
Min = 0 mV
Max = 16000 mVSets USG Voltage (CV mode) for 1st bonds
Note: - Under USG CV mode, the voltage across the transducer is simply held constant, regardless of the impedance - Yet both laser test reveals that transducer impedance variation results in the transducer displacement (hence bond strength) - High-impedance transducers tend to has less displacement then those with lower impedance ones.
USG Current 1Default = 80 mA
Min = 0 mA
Max = 250 mA
Sets USG Current (CC mode) for 1st bonds
Note: - This is the recommended USG mode, as the current through the transducer is held constant, regardless of impedance - Typical range is from 70mA to 120mA for 1st bonds
ParameterDefault / Allowable RangeFunctionUSG Bond Time 1
Default = 7 ms
Min = 0 ms
Max = 3980 ms
The bonding time for 1st bond
Note: - Wire clamp is open during Bonding Time [6] - Typical range is from 6ms to 15ms, device-dependent
Force 1Default = 35 grams
Min = 0 grams
Max = 350 gramsThe 1st bond force being applied during bonding
Note: - Typical range is from 20grams to 40grams, device-dependent - For fine-pitch (FP) application, the force as low as 15grams might be used
